Sivers Semiconductors AB (STO: SIVE) has announced a strategic USD 30 million investment to substantially expand its Indium Phosphide (InP) manufacturing facility in Glasgow, Scotland. The expansion is aimed at supporting expected increases in customer production as demand for AI data centers and advanced optical networking continues to grow.
Upon completion, the expanded facility is expected to support annual production of more than 100 million CW DFB lasers, while adding new process capabilities, increased automation and greater manufacturing flexibility. The expansion program will begin in the second half of 2026 and is expected to become operational in the fourth quarter of 2027.
The investment marks an important step in Sivers’ transition from a Fab-Lite manufacturing model to a Hybrid Manufacturing strategy, combining expanded in-house manufacturing capabilities with strategic foundry, packaging, and manufacturing partners.
“The scale of today’s AI infrastructure build-out is creating unprecedented demand across the optical supply chain. Our customers need significantly more laser production capacity and, just as importantly, the confidence that supply will be there when their programs ramp. This investment positions us, along with our foundry partners, to meet that demand.”
-Vickram Vathulya, President and CEO of Sivers Semiconductors
As hyperscale operators build larger AI clusters and move toward higher-speed networking architectures, demand for advanced optical interconnect technologies is accelerating. Sivers believes InP-based lasers and semiconductor optical amplifiers will play an increasingly important role in enabling the high-performance, energy-efficient optical connectivity required by these systems.
The investment reflects increasing customer engagement across AI datacenter and advanced optical interconnect applications and is designed to ensure manufacturing capacity is available as customer programs advance toward volume production.
“Scaling photonics for AI infrastructure requires more than increasing capacity. It requires a manufacturing strategy built for flexibility, quality, and long-term customer demand. By combining our planned expansion in Glasgow with the manufacturing capacity of our external foundry partners, we can scale efficiently while maintaining the supply flexibility our customers need. This approach gives Sivers the ability to support high-volume production as AI infrastructure deployments accelerate.”
-Neeraj Chopra, COO of Sivers Semiconductors
The Glasgow expansion will complement Sivers’ broader manufacturing ecosystem, including foundry, packaging and manufacturing partners in Asia. This Hybrid Manufacturing approach is designed to provide greater production scalability, geographic flexibility and supply-chain resilience while maintaining strategic in-house manufacturing capabilities for Sivers’ core photonics technologies.
We are driving the transition toward a greener data economy through energy-efficient photonics and wireless technologies. Our advanced, high-precision laser and RF beamformer solutions enable customers across critical markets, including AI data centers, SATCOM, defense, and telecommunications, to overcome key performance challenges while reducing their environmental footprint.
