GS Microelectronics U.S., Inc. (GSME), a provider of semiconductor solutions, has announced its official membership in TSMC’s Open Innovation Platform® (OIP) Value Chain Alliance (VCA) as a North American member partner. The collaboration strengthens GSME’s established capabilities in combining design-enablement building blocks with solutions from OIP Ecosystem partners to provide end-to-end ASIC services. Its offerings cover the complete IC value chain, including IP development, front-end architecture, back-end physical design, wafer fabrication, advanced packaging, assembly, and testing.
The collaboration with TSMC comes during a period of rapid international scaling for GSME. Founded in 2022, the company has grown from a Silicon Valley startup into a global operation in San Jose, Phoenix, Hsinchu, Ho Chi Minh City, Danang, and Muscat. Backed by Series B funding from Maverick Silicon, GSME continues to scale its design services, advanced packaging, IP portfolio, and AI-driven supply chain capabilities.
“Joining TSMC’s OIP ecosystem as a VCA partner in North America underscores our commitment to delivering a unified, execution‑driven platform for our customers. Our mission is to give customers a tightly integrated and lower‑risk path from early MPW exploration straight into high‑volume production with end-to-end visibility, eliminating the cost, delay, and fragmentation that come from handing designs across multiple vendors.”
–Farhat Jahangir, President and CEO of GSME.
“TSMC is pleased to welcome GSME as an OIP Value Chain Alliance partner in North America. By combining TSMC’s advanced process and packaging technologies with GSME’s design and turnkey services, we are strengthening our OIP ecosystem and expanding the support available to our mutual customers as they develop innovative silicon solutions.”
–Percy Chang, Director of Emerging Business Development at TSMC.
GSME’s Value-Added Services
Unlike traditional semiconductor service providers that focus on isolated stages of the value chain, GSME supports customers across the full silicon lifecycle through a unified set of capabilities.
The company’s accessible MPW services offer a low-risk entry point for early silicon validation that transitions seamlessly into turnkey high-volume manufacturing, accelerating time-to-market. Backed by end-to-end design expertise in front-end architecture, back-end implementation, quality assurance, and technology incubation, GSME is also actively developing 2.5D/3D advanced packaging capabilities, including support for TSMC CoWoS®-based architectures to serve AI and HPC verticals. This entire lifecycle is tied together by GSME’s agentic LLM platform, which provides customers with integrated supply chain visibility from wafer, assembly, to yield.
GS Microelectronics U.S., Inc. (GSME) is a leading semiconductor solutions provider headquartered in San Jose, California, with a global presence in Taiwan, Vietnam, and Oman. GSME delivers tailored silicon solutions by leveraging cutting-edge technology and proven domain expertise. The company offers end-to-end chip design, full turnkey manufacturing, quality assurance & reliability, product sustaining, continuous improvement plan (CIP), and strategic incubation services, enabling customers to accelerate innovative products and rapidly scale to market.
